ST4SIM-110M

Active

SIM & eSIM system-on-chip solution for secure M2M industrial applications

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Product overview

Description

The ST4SIM-110M is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for all industrial devices. The ST4SIM-110M pre-integrates a cellular connectivity configuration provided by trusted partners. In this way, the product is ready to be deployed to the field.
The device ensures the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.
The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.
  • All features

      • Cellular network connectivity configuration provided by trusted partners
      • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
      • Network access applications supported: SIM / USIM / ISIM / CSIM
      • Secure element access control (ARF / PKCS#15)
      • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
      • Multi-interfaces able to combine (U)SIM + eSE
    • Hardware
      • Product available on ST33G1M2M
      • ST33 product based on a 32-bit Arm® SecurCore® SC300 RISC core
      • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
      • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
      • Serial peripheral interface (SPI), depending on packages
      • Industrial qualification (JEDEC JESD47)
      • Operating temperature: -40°C to +105°C
      • Common Criteria EAL5+
    • ECOPACK-compliant packages
      • 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
      • DFN8 with wettable flanks (MFF2)
      • WLCSP11
    • Security
      • Symmetric cryptography DES / 3DES / AES
      • Asymmetric cryptography RSA (up to 2048 bits)
      • HTTPS remote management TLS v1.0, v1.1 and v1.2
      • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
      • Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE
    • Software standard compliancy
      • Java® Card v3.0.4 Classic
      • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
      • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)
      • Power saving features (PSM and eDRX) defined by ETSI release 13

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      Description:

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      Type
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EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST4SIM-110M

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

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Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
ST4SI1M0008SCIFW
Active
VFDFPN 8 5X6 WETTABLE FLANK Industrial N/A
ST4SIM-110M
Active
DICE Industrial N/A

ST4SI1M0008SCIFW

Package:

VFDFPN 8 5X6 WETTABLE FLANK

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFDFPN 8 5X6 WETTABLE FLANK

Grade

Industrial

RoHS Compliance Grade

N/A

ST4SIM-110M

Package:

DICE

Material Declaration**:

Marketing Status

Active

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
ST4SI1M0008SCIFW No availability of distributors reported, please contact our sales office
Active
3A991A2 NEC Tape And Reel VFDFPN 8 5X6 WETTABLE FLANK - - PHILIPPINES
ST4SIM-110M No availability of distributors reported, please contact our sales office
Active
3A991A2 NEC Not Applicable DICE - - FRANCE

ST4SI1M0008SCIFW

Marketing Status

Active

ECCN (US)

3A991A2

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFDFPN 8 5X6 WETTABLE FLANK

Operating Temperature (°C)

(min)

-

(max)

-

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST4SIM-110M

Marketing Status

Active

ECCN (US)

3A991A2

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Not Applicable

Package

DICE

Operating Temperature (°C)

(min)

-

(max)

-

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors