-
The A22H165M is a class-G stereo headphone driver dedicated to high audio performance, high power efficiency and space-constrained applications such as wearable and fitness.
It is based on the core technology of a low power dissipation amplifier combined with a high efficiency buck converter for supplying this amplifier.
When powered by a battery, the buck converter generates the appropriate voltage to the amplifier depending on the amplitude of the audio signal to supply the headsets. It achieves a total 2.1 mA current consumption at 100 μW output power (10 dB crest factor).
THD+N is 0.02% maximum at 1 kHz and PSRR is 100 dB at 217 Hz, which ensures a high audio quality of the device in a wide range of environments.
The traditionally bulky output coupling capacitors can be removed.
A dedicated common-mode sense pin removes parasitic ground noise.
The A22H165M is designed to be used with an output serial resistor. It ensures unconditional stability over a wide range of capacitive loads. The A22H165M is packaged in a tiny 16-bump flip-chip package with a pitch of 400 μm.Key Features
- Power supply range: 2.3 V to 4.8 V
- 0.6 mA/channel quiescent current
- 2.1 mA current consumption with 100 μW/channel (10 dB crest factor)
- 0.006% typical THD+N at 1 kHz
- 100 dB typical PSRR at 217 Hz
- 100 dB of SNR A-weighted at G = 0 dB
- Zero pop and click
- I²C interface for volume control
- Digital volume control range from -60 dB to +4 dB
- Independent right and left channel shutdown control
- Integrated high-efficiency buck converter
- Low software standby current: 5 μA max
- Output coupling capacitors removed
- Thermal shutdown and short-circuit protection
- Flip-chip package: 1.65 mm x 1.65 mm, 400 μm pitch, 16 bumps
All resources
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 27 Aug 2020 |
27 Aug 2020
|
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 23 Nov 2020 |
23 Nov 2020
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - A22H165M
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| A22H165MJ |
Active
|
CSP P 0.4 mm | Industrial | Ecopack3 |
|
A22H165MJ
Package:
CSP P 0.4 mmMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| A22H165MJ | No availability of distributors reported, please contact our sales office | Buy Direct |
Active
|
EAR99 | NEC | Tape And Reel | CSP P 0.4 mm | -40 | 85 | CHINA | 0.2295 / 1k | |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
