Product overview
Description
The device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI or USB 2.0. Also it can protect and filter one differential lane.-
All features
- High common mode attenuation:
- -34 dB at 900 MHz
- -20 dB between 800 MHz and 2.2 GHz
- Large bandwidth: 1.7 GHz
- Very low PCB space consumption
- Thin package: 0.55 mm max.
- RoHS package
- High reduction of parasitic elements through integration
- High common mode attenuation:
Circuit Diagram
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All tools & software
All resources
| Resource title | Latest update |
|---|
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 02 Mar 2017 | 02 Mar 2017 |
Application Notes (5 of 7)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 | 13 Sep 2018 | |||
| 13 Sep 2018 | 13 Sep 2018 | |||
| 06 Aug 2019 | 06 Aug 2019 | |||
| 06 Aug 2019 | 06 Aug 2019 | |||
| 24 Mar 2020 | 24 Mar 2020 | |||
| 13 Sep 2018 | 13 Sep 2018 | |||
| 19 Mar 2021 | 19 Mar 2021 |
Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Aug 2020 | 25 Aug 2020 |
Application Notes for related Tools & Software (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 30 Nov 2020 | 30 Nov 2020 |
Presentations (5)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Nov 2019 | 18 Nov 2019 | |||
| 18 Dec 2015 | 18 Dec 2015 | |||
| 18 Mar 2021 | 18 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 18 Mar 2021 | 18 Mar 2021 |
Flyers (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Jan 2021 | 13 Jan 2021 |
White Papers (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 12 Jan 2018 | 12 Jan 2018 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ECMF02-2AMX6
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Latest update |
|---|
HW Models (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 15 Apr 2016 | 15 Apr 2016 |
CAD Symbol & Footprint models (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 18 Mar 2020 | 18 Mar 2020 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| ECMF02-2AMX6 | Active | QFN-6L | Industrial | Ecopack2 | |
ECMF02-2AMX6
Package:
QFN-6LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| ECMF02-2AMX6 | 6 distributors | Free Sample Buy Direct | Active | EAR99 | NEC | Tape And Reel | QFN-6L | - | - | CHINA | ||
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
