Product overview
Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP1 Series to allow users easily develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the co-processor. They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbps connector, one USB Type-C® OTG connector, four USB Type-A Host connectors, one HDMI® transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO® and Raspberry Pi® shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi-Fi® and Bluetooth® Low Energy capability.
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All features
- Common features
- STM32MP157 Arm®-based dual Cortex®-A7 800 MHz 32 bits + Cortex®-M4 32 bits MPU in TFBGA361 package
- ST PMIC STPMIC1
- 4-Gbit DDR3L, 16 bits, 533 MHz
- 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
- USB OTG HS
- Audio codec
- 4 user LEDs
- 2 user and reset push-buttons, 1 wake-up button
- 5 V / 3 A USB Type-C® power supply input (not provided)
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Board connectors:
Ethernet RJ45 4 × USB Host Type-A USB Type-C® DRP MIPI DSISM HDMI® Stereo headset jack including analog microphone input microSD™ card GPIO expansion connector (Raspberry Pi® shield capability) ARDUINO® Uno V3 expansion connectors - On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
- STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- Board-specific features
- 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
- Wi-Fi® 802.11b/g/n
- Bluetooth® Low Energy 4.1
- Common features
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All resources
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Product Specifications (1)
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28 Oct 2020 |
28 Oct 2020
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Technical Notes & Articles (1)
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21 Nov 2019
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User Manuals (1)
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12 Nov 2020
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Presentations (1)
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21 Jan 2020
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Flyers (1)
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08 Jun 2020
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License Agreement (1)
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21 Sep 2016 |
21 Sep 2016
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Evaluation Board Terms of Use (1)
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07 Oct 2020
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All resources
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Board Manufacturing Specifications (4)
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Bill of Materials (2)
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Schematic Pack (2)
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Quality and Reliability
Part Number | Marketing Status | RoHS Compliance Grade | Material Declaration** |
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STM32MP157F-DK2 |
Active
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Ecopack1 |
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STM32MP157F-DK2
Package:
Ecopack1Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Order from Distributors | Order from ST | Core Product | Marketing Status | Supplier | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
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STM32MP157F-DK2 | 1 distributors | STM32MP157FAC1 |
Active
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ST | 5A992C | 5A002A4 | - | CHINA | true | 109.0 / 1 |
Core Product
STM32MP157FAC1Marketing Status
ActiveBudgetary Price (US$)*/Qty
109.0 / 1(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors