VD55G0

Preview

Consumer Global Shutter 0.4Mp

Download databrief
Overview
Online design
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Partner products
Sales Briefcase

Product overview

Description

The VD55G0 is a global shutter image sensor optimized for near infrared scenes. The sensor captures up to 210 fps in a 640 x 600 pixel resolution format. The pixel construction of this device minimises crosstalk.
  • All features

    • Global shutter technology, ST proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)
    • High-performance with excellent
      • QE (quantum efficiency)
      • MTF (modulation transfer function) up to near IR
      • Perfect PLS (shutter efficiency)
    • Smallest sensor on market with:
      • Compact die size: 2.6 mm x 2.5 mm
      • 640 pixel x 600 pixel resolution
      • Very small pixel array, 1.67 mm x 1.57 mm
      • Optical format between 1/9 inch
    • Operating junction temperature: -30 °C to 85 °C
    • Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.2 Gbps per lane
    • Fast mode+ I2C control interface
    • Integrated temperature sensor
    • Up to 210 fps (frames per second) at full resolution and 260 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic and map-based defective correction
    • Embedded auto-exposure with 8 x 8 = 64 zone statistics
    • 4 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 4 illumination control outputs synchronized with sensor integration periods and master/slave external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Sub sampling (x2 and x4)

Recommended for you

Related Applications

Industrial

EDA Symbols, Footprints and 3D Models

STMicroelectronics - VD55G0

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
VD55G0CC/RW
Preview
GOOD DIE Industrial N/A

VD55G0CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
VD55G0CC/RW No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tape Mounted GOOD DIE -30 85 TAIWAN

VD55G0CC/RW

Marketing Status

Preview

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape Mounted

Package

GOOD DIE

Operating Temperature (°C)

(min)

-30

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

TAIWAN

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors