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The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.
The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.
The sensitivity of the IMP23ABSU is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.Key Features
- Single supply voltage operation 1.52 V - 3.6 V
- Omnidirectional sensitivity
- High signal-to-noise ratio
- High acoustic overload point: 130 dBSPL typ.
- Package compliant with reflow soldering
- Enhanced RF immunity
- Ultra-flat frequency response
- Ultrasound bandwidth (up to 80 kHz)
- Low latency
- Ultra-low-power: 150 µA max.
- ECOPACK, RoHS, and “Green” compliant
Featured Videos
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
All resources
Product Specifications (1)
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| 17 Sep 2020 |
17 Sep 2020
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Application Notes (1)
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| 17 Sep 2020 |
17 Sep 2020
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Presentations (1)
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| 13 Nov 2020 |
13 Nov 2020
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Flyers (2)
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| 26 Feb 2020 |
26 Feb 2020
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| 11 Nov 2020 |
11 Nov 2020
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Brochures (3)
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| 09 Dec 2020 |
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| 06 Aug 2020 |
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| 19 Sep 2019 |
19 Sep 2019
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - IMP23ABSU
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| IMP23ABSUTR |
Active
|
RHLGA 2.65X3.5X1.08(MAX)MM 4L | Ecopack1 |
|
IMP23ABSUTR
Package:
RHLGA 2.65X3.5X1.08(MAX)MM 4LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| IMP23ABSUTR | 4 distributors | Free Sample Buy Direct |
Active
|
EAR99 | NEC | Tape And Reel | RHLGA 2.65X3.5X1.08(MAX)MM 4L | -40 | 85 | CHINA | 1.0 / 1k | |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
