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LIS3DSH

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3-axis accelerometer, ±2g/±4g/±6g/±8g/±16g user selectable full-scale, SPI/I2C digital output, ultra low-power, high performance

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Product overview

Description

The LIS3DSH is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “nano” family with an embedded state machine that can be programmed to implement autonomous applications. The LIS3DSH has dynamically selectable full scales of ±2g/±4g/±6g/±8g/±16g and is capable of measuring accelerations with output data rates from 3.125 Hz to 1.6 kHz.
The self-test capability allows the user to check the functioning of the sensor in the final application.
The device can be configured to generate interrupt signals activated by user-defined motion patterns.
The LIS3DSH has an integrated first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor.
The LIS3DSH is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

  • All features

    • Wide supply voltage, 1.71 V to 3.6 V
    • Independent IOs supply (1.8 V) and supply voltage compatible
    • Ultra-low power consumption
    • ±2g/±4g/±6g/±8g/±16g dynamically selectable full scale
    • I2C/SPI digital output interface
    • 16-bit data output
    • Programmable embedded state machines
    • Embedded temperature sensor
    • Embedded self-test
    • Embedded FIFO
    • 10000 g high shock survivability
    • ECOPACK®, RoHS and “Green” compliant
    Read more Read less

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    • Part number
      		Status
      		Description
      		Type
      		Supplier

      Accel2 click

      Active

      Accel 2 click carries ST's LIS3DSH IC, a low-power factory-calibrated three-axis accelerometer which embeds a FIFO buffer and two programmable state machines.

      		 Components and Modules MikroElektronika
      Accel2 click

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      Accel 2 click carries ST's LIS3DSH IC, a low-power factory-calibrated three-axis accelerometer which embeds a FIFO buffer and two programmable state machines.
    • Part number
      		Status
      		Description
      		Type
      		Supplier

      FAE Engineering Services

      Active

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      		 Engineering Services FAE Technology
      FAE Engineering Services

      Description:

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      Hardware and firmware design

      Active

      Complete hardware and firmware design for all applications

      		 Engineering Services SIANA Systems
      Hardware and firmware design

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      Complete hardware and firmware design for all applications

      SensiEDGE customization services

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      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

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    • Part number
      		Status
      		Description
      		Type
      		Supplier

      AndroidHALInput

      Active

      Android sensor HAL for MEMS motion and environmental sensors (Input framework)

      		 Drivers for MEMS ST
      AndroidHALInput

      Description:

      Android sensor HAL for MEMS motion and environmental sensors (Input framework)

      C-Driver-MEMS

      Active

      Standard C platform-independent drivers for MEMS motion and environmental sensors

      		 Drivers for MEMS ST
      C-Driver-MEMS

      Description:

      Standard C platform-independent drivers for MEMS motion and environmental sensors

      LinuxDriverInput

      Active

      Linux device drivers for MEMS motion and environmental sensors (Input framework)

      		 Drivers for MEMS ST
      LinuxDriverInput

      Description:

      Linux device drivers for MEMS motion and environmental sensors (Input framework)
    • Part number
      		Status
      		Description
      		Type
      		Supplier

      STEVAL-MKI134V1

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      LIS3DSH adapter board for standard DIL24 socket

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All resources

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Resource title
Latest update

Product Specifications (1)

Resource title
Latest update
DS8721 MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer 3.0
01 Sep 2017
01 Sep 2017
DS8721 MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer 3.0

Application Notes (3)

Resource title
Latest update
AN3393 LIS3DSH: 3-axis digital output accelerometer 5.0
03 Mar 2017
03 Mar 2017
AN3393 LIS3DSH: 3-axis digital output accelerometer 5.0
AN4508 Parameters and calibration of a low-g 3-axis accelerometer 1.0
28 Feb 2020
28 Feb 2020
AN4508 Parameters and calibration of a low-g 3-axis accelerometer 1.0
AN4509 Tilt measurement using a low-g 3-axis accelerometer 1.1
19 Mar 2021
19 Mar 2021
AN4509 Tilt measurement using a low-g 3-axis accelerometer 1.1

Technical Notes & Articles (1)

Resource title
Latest update
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2
18 Jan 2021
18 Jan 2021
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5 of 7)

Resource title
Latest update
DT0105 1-point or 3-point tumble sensor calibration 1.1
21 Jan 2021
21 Jan 2021
DT0105 1-point or 3-point tumble sensor calibration 1.1
DT0053 6-point tumble sensor calibration 1.1
21 Jan 2021
21 Jan 2021
DT0053 6-point tumble sensor calibration 1.1
DT0011 Benefits in using FIFO buffer embedded in ST MEMS sensors 1.0
13 Nov 2016
13 Nov 2016
DT0011 Benefits in using FIFO buffer embedded in ST MEMS sensors 1.0
DT0077 LIS3DSH State Machine Quick Guide 3.0
04 Feb 2020
04 Feb 2020
DT0077 LIS3DSH State Machine Quick Guide 3.0
DT0126 Low-power application design with ST's MEMS accelerometers 1.1
21 Jan 2021
21 Jan 2021
DT0126 Low-power application design with ST's MEMS accelerometers 1.1
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1
21 Jan 2021
21 Jan 2021
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1
DT0127 ST's MEMS accelerometer sensor testing & self-test 1.2
21 Jan 2021
21 Jan 2021
DT0127 ST's MEMS accelerometer sensor testing & self-test 1.2
Load more

Flyers (2)

Resource title
Latest update
3-axis digital accelerometers for smarter, easier-to-use and energy-efficient portable devices 2.0
15 Apr 2015
15 Apr 2015
3-axis digital accelerometers for smarter, easier-to-use and energy-efficient portable devices 2.0
IIS2ICLX: 2-axis, high-accuracy inclinometer with embedded machine-learning 1.1
19 Jan 2021
19 Jan 2021
IIS2ICLX: 2-axis, high-accuracy inclinometer with embedded machine-learning 1.1

Brochures (5 of 6)

Resource title
Latest update
MEMS Sensors for automotive applications 1.0
13 Jun 2019
13 Jun 2019
MEMS Sensors for automotive applications 1.0
MEMS and Sensors Quick Reference Guide 2.0
07 Apr 2021
07 Apr 2021
MEMS and Sensors Quick Reference Guide 2.0
MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 2.1
06 Aug 2020
06 Aug 2020
MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 2.1
Peripheral semiconductors for set-top box applications 4.3
08 Apr 2019
08 Apr 2019
Peripheral semiconductors for set-top box applications 4.3
ST's Condition Monitoring Solutions brochure 01.21
19 Mar 2021
19 Mar 2021
ST's Condition Monitoring Solutions brochure 01.21
Sensor libraries software pack for STM32Cube 2.0
25 Feb 2021
25 Feb 2021
Sensor libraries software pack for STM32Cube 2.0
Load more

White Papers (1)

Resource title
Latest update
Capacitive MEMS accelerometer for condition monitoring 1.0
04 Dec 2018
04 Dec 2018
Capacitive MEMS accelerometer for condition monitoring 1.0

EDA Symbols, Footprints and 3D Models

STMicroelectronics - LIS3DSH

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LIS3DSHTR
Active
LLGA 16 3x3x1.0 Ecopack2

LIS3DSHTR

Package:

LLGA 16 3x3x1.0

Material Declaration**:

PDF XML
More Info

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LIS3DSHTR No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape And Reel LLGA 16 3x3x1.0 - - MALTA 0.832 / 1k

LIS3DSHTR

Marketing Status

Active

ECCN (US)

EAR99
More Info

Budgetary Price (US$)*/Qty

0.832 / 1k

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

LLGA 16 3x3x1.0

Operating Temperature (°C)

(min)

-

(max)

-

Budgetary Price (US$)* / Qty

0.832 / 1k

Country of Origin

MALTA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors