LSM6DSO32

Active

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

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Product overview

Description

The LSM6DSO32 is a system-in-package featuring a 3D digital accelerometer and 3D digital gyroscope boosting power performance to 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSO32 supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO32 has a full-scale acceleration range of ±4/±8/±16±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32 is available in a plastic land grid array (LGA) package.
  • All features

    • Power consumption: 0.55 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 9 kbytes
    • ±4/±8/±16/±32 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (1.62 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
    • Advanced pedometer, step detector and step counter
    • Significant Motion Detection, Tilt detection
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Programmable finite state machine: accelerometer, gyroscope and external sensors
    • Embedded temperature sensor
    • ECOPACK, RoHS and “Green” compliant

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      FAE Engineering Services

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      X-CUBE-MEMS1

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DSO32

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LSM6DSO32TR
Active
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSO32TR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

Marketing Status

Active

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LSM6DSO32TR No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape And Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES 1.75 / 1k

LSM6DSO32TR

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

1.75 / 1k

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

1.75 / 1k

Country of Origin

PHILIPPINES

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors