Product overview
Description
The LSM6DSOP is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSOP has been designed for smart pen applications, offering multiple power modes and also real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.The LSM6DSOP has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSOP the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOP is available in a plastic land grid array (LGA) package.
For further information, please contact your local ST sales office or your distributor.
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All features
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbytes
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C serial interface with main processor data synchronization
- Standard interrupts: wakeup, 6D/4D orientation, activity/inactivity recognition, stationary/motion detection
- Programmable Finite State Machine: accelerometer, gyroscope
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
Featured Videos
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
LSM6DSOX IMU embeds a Machine Learning Core able to run with only 5 uA, to pre-process and classify information coming from its internal gyro and accelerometer plus up to 4 external sensors to save system-level power since the main MCU can be put in sleep mode for significant amount of time.
A bridge between the sensor on the motherboard and your laptop
All tools & software
All resources
| Resource title | Latest update |
|---|
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Feb 2020 | 18 Feb 2020 |
Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Jan 2021 | 18 Jan 2021 |
Design Notes & Tips (5)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 21 Jan 2021 | 21 Jan 2021 | |||
| 08 Jan 2021 | 08 Jan 2021 | |||
| 11 Jan 2021 | 11 Jan 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 21 Jan 2021 | 21 Jan 2021 |
Presentations (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Jan 2021 | 13 Jan 2021 |
Flyers (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 11 Mar 2020 | 11 Mar 2020 | |||
| 01 Jul 2020 | 01 Jul 2020 | |||
| 11 Mar 2020 | 11 Mar 2020 |
Brochures (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Jun 2019 | 13 Jun 2019 | |||
| 07 Apr 2021 | 07 Apr 2021 | |||
| 06 Aug 2020 | 06 Aug 2020 | |||
| 25 Feb 2021 | 25 Feb 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM6DSOP
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSOPTR | Active | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
LSM6DSOPTR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM6DSOPTR | No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape And Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | |||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
