Product overview
Description
The LSM9DS1 is a system-in-package featuring a 3D digital linear acceleration sensor, a 3D digital angular rate sensor, and a 3D digital magnetic sensor. The LSM9DS1 has a linear acceleration full scale of ±2g/±4g/±8/±16 g, a magnetic field full scale of ±4/±8/±12/±16 gauss and an angular rate of ±245/±500/±2000 dps.The LSM9DS1 includes an I2C serial bus interface supporting standard and fast mode (100 kHz and 400 kHz) and an SPI serial standard interface.
Magnetic, accelerometer and gyroscope sensing can be enabled or set in power-down mode separately for smart power management.
The LSM9DS1 is available in a plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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All features
- 3 acceleration channels, 3 angular rate channels, 3 magnetic field channels
- ±2/±4/±8/±16 g linear acceleration full scale
- ±4/±8/±12/±16 gauss magnetic full scale
- ±245/±500/±2000 dps angular rate full scale
- 16-bit data output
- SPI / I2C serial interfaces
- Analog supply voltage 1.9 V to 3.6 V
- “Always-on” eco power mode down to 1.9 mA
- Programmable interrupt generators
- Embedded temperature sensor
- Embedded FIFO
- Position and motion detection functions
- Click/double-click recognition
- Intelligent power saving for handheld devices
- ECOPACK®, RoHS and “Green” compliant
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 3.0 | 23 Mar 2015 | 23 Mar 2015 |
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.3 | 29 Jun 2021 | 29 Jun 2021 |
Design Notes & Tips (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 3.0 | 08 Jan 2021 | 08 Jan 2021 | ||
| 3.0 | 11 Jan 2021 | 11 Jan 2021 | ||
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 |
Presentations (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 15 Jun 2021 | 15 Jun 2021 | ||
| 1.0 | 13 Jan 2021 | 13 Jan 2021 |
Flyers (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 11 Mar 2020 | 11 Mar 2020 | ||
| 2.0 | 01 Jul 2020 | 01 Jul 2020 | ||
| 1.0 | 11 Mar 2020 | 11 Mar 2020 |
Brochures (4)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 2.0 | 25 Feb 2021 | 25 Feb 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM9DS1
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM9DS1TR | Active | TFLGA 3.5X3X1 24L | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM9DS1TR | 1 distributors | Active | EAR99 | NEC | Tape And Reel | TFLGA 3.5X3X1 24L | -40 | 85 | MALTA | 4.8435 / 1k | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
4.8435 / 1k(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
