Based on an Arm® Cortex®-M4 core running at 64 MHz (application processor) and an Arm Cortex‐M0+ core at 32 MHz (network processor), STM32WBx5 wireless microcontrollers all support Bluetooth® LE 5.2, and several STM32WBx5 lines can also run IEEE 802.15.4 Zigbee®, Thread and concurrent wireless standards.
Bluetooth LE 5.2-certified, STM32WBx5 wireless MCUs can support Mesh 1.0 network, multiple profiles and offer flexibility to integrate proprietary Bluetooth LE stacks on top of HCI layer. The generic IEEE 802.15.4 MAC layer ensures the STM32WBx5 can run proprietary protocols or stacks, including Zigbee PRO (coming with a wide set of Zigbee 3.0 Clusters) and OpenThread mesh networking protocols, giving designers even more options for connecting devices to the IoT.
These ultra-low-power 32-bit wireless microcontrollers can run Bluetooth LE 5.2 and 802.15.4 wireless protocols concurrently in a static or dynamic manner. The dual-core architecture supports secured Over-The-Air (OTA) updates of the protocol stack to future-proof the radio link maintenance and user application.
- The STM32WB55 offers up to 1 Mbyte Flash memory to ensure your application runs smoothly, whatever the protocol stack solution, without th need for an external Flash memory component. However, depending on application-specific memory requirements, an external memory component can be connected with XIP for better overall efficiency.
- The STM32WB35 is suitable for Bluetooth LE 5.2 or 802.15.4 applications and offers a set of peripherals that includes USB 2.0, Quad-SPI, ADC with up to 16 bits of resolution, leveraging the dual core of the MCU and the RF front end to optimize BOM costs.
- The STM32WB15 focuses on Bluetooth LE 5.2 applications, offering the benefits of a dual-core microcontroller in a smaller-sized product with 320 Kbytes of Flash memory and a variety of peripherals like Touch sensing. Available in UQFN48 package that features up to 37 GPIOs.
Package information and options
STM32WBx5 wireless microcontrollers provide designers flexibility in terms of pin counts, memory size and form factors to match end device geometry and PCB technology.
All STM32WBx5 MCUs are available in a UFQFPN48 package with pin-to-pin compatibility to ensure device scalability while reducing development effort.
Four ECOPACK2®-compliant packages with three different memory sizes are available to address different levels of complexity to match application requirements.
A variety of STM32WB evaluation boards from Nucleos to Discovery boards, together with STM32Cube Ecosystem, form a consistent set of hardware and software development tools to quickly and easily start developing your application across the whole STM32WB portfolio.
The ultra-low power STM32WB MCUs are based on a dual-core architecture and support multiple protocols. STM32WB comes with many wireless stacks to address Bluetooth LE, Zigbee, and Thread, in single and concurrent modes.