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製品概要

概要

The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I²C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.
The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

特徴
3 magnetic field channels and 3 acceleration channels

±50 gauss magnetic dynamic range

±2/±4/±8/±16 g selectable acceleration full scales

16-bit data output

SPI / I²C serial interfaces

Analog supply voltage 1.71 V to 3.6 V

Selectable power mode/resolution for accelerometer and magnetometer
Single measurement mode for magnetometer

Programmable interrupt generators for free-fall, motion detection and magnetic field detection

Embedded self-test

Embedded temperature sensor

Embedded FIFO

ECOPACK^®, RoHS and “Green” compliant
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SensorTile.box: Pro Mode

This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.

Watch the video (09:54)

SensorTile.box: Expert mode

Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.

Watch the video (13:32)

SensorTile.box: Basic mode

The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.

Watch the video (09:41)

推奨コンテンツ

All tools & software

コンポーネント & モジュール

製品型番	ステータス	概要	タイプ	サプライヤ
LSM303AGR click	量産中	LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer.	コンポーネント & モジュール	MikroElektronika	LSM303AGR click 概要: LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer.
SensiBLE	量産中	Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!	コンポーネント & モジュール	SensiEDGE	SensiBLE 概要: Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
SensiBLE 2.0	量産中	SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.	コンポーネント & モジュール	SensiEDGE	SensiBLE 2.0 概要: SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
SensiBLE 2.1	量産中	SensiBLE 2.1 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.	コンポーネント & モジュール	SensiEDGE	SensiBLE 2.1 概要: SensiBLE 2.1 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
SensiSUB	量産中	Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.	コンポーネント & モジュール	SensiEDGE	SensiSUB 概要: Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

エンジニアリング･サービス

製品型番	ステータス	概要	タイプ	サプライヤ
FAE Engineering Services	量産中	Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.	エンジニアリング･サービス	FAE Technology	FAE Engineering Services 概要: Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
SensiEDGE customization services	量産中	End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!	エンジニアリング･サービス	SensiEDGE	SensiEDGE customization services 概要: End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

ソフトウェア開発ツール

製品型番	ステータス	概要	タイプ	サプライヤ
X-CUBE-MEMS-XT1	NRND	Sensor and DSP algorithm software expansion for STM32Cube	STM32Cube拡張パッケージ	ST	X-CUBE-MEMS-XT1 概要: Sensor and DSP algorithm software expansion for STM32Cube
X-CUBE-MEMS1	量産中	Sensor and motion algorithm software expansion for STM32Cube	STM32Cube拡張パッケージ	ST	X-CUBE-MEMS1 概要: Sensor and motion algorithm software expansion for STM32Cube

MEMS and Sensors Software

製品型番	ステータス	概要	タイプ	サプライヤ
AndroidHAL-IIO	量産中	Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)	MEMS用ドライバ	ST	AndroidHAL-IIO 概要: Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
AndroidHALInput	量産中	Android sensor HAL for MEMS motion and environmental sensors (Input framework)	MEMS用ドライバ	ST	AndroidHALInput 概要: Android sensor HAL for MEMS motion and environmental sensors (Input framework)
C-Driver-MEMS	量産中	Standard C platform-independent drivers for MEMS motion and environmental sensors	MEMS用ドライバ	ST	C-Driver-MEMS 概要: Standard C platform-independent drivers for MEMS motion and environmental sensors
LinuxDriverIIO	量産中	Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)	MEMS用ドライバ	ST	LinuxDriverIIO 概要: Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
LinuxDriverInput	量産中	Linux device drivers for MEMS motion and environmental sensors (Input framework)	MEMS用ドライバ	ST	LinuxDriverInput 概要: Linux device drivers for MEMS motion and environmental sensors (Input framework)

Product Evaluation Tools

製品型番	ステータス	概要	タイプ	サプライヤ
STEVAL-MKI172V1	量産中	LSM303AGR adapter board for a standard DIL 24 socket	MEMSモーションセンサ用評価ボード	ST	STEVAL-MKI172V1 概要: LSM303AGR adapter board for a standard DIL 24 socket

ソリューション用評価ボード

製品型番	ステータス	概要	タイプ	サプライヤ
STEVAL-STLCS01V1	量産中	SensorTile connectable sensor node: plug or solder	センサIC用評価ボード	ST	STEVAL-STLCS01V1 概要: SensorTile connectable sensor node: plug or solder
STEVAL-STLCS02V1	量産中	SensorTile connectable sensor node: solder only	センサIC用評価ボード	ST	STEVAL-STLCS02V1 概要: SensorTile connectable sensor node: solder only

STM32 Open Development Environment

製品型番	ステータス	概要	タイプ	サプライヤ
X-NUCLEO-IKS01A2	量産中	Motion MEMS and environmental sensor expansion board for STM32 Nucleo	STM32 ODE Sense HW	ST	X-NUCLEO-IKS01A2 概要: Motion MEMS and environmental sensor expansion board for STM32 Nucleo

All resources

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	Resource title		Latest update

製品スペック (1)

	Resource title		Latest update
PDF	DS10999 Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer 10.0		29 Nov 2018	29 Nov 2018 DS10999 Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer 10.0

アプリケーションノート (1)

	Resource title		Latest update
PDF	AN4825 Ultra-compact high-performance eCompass module based on the LSM303AGR 1.0		22 Nov 2018	22 Nov 2018 AN4825 Ultra-compact high-performance eCompass module based on the LSM303AGR 1.0

技術ノート & 解説 (1)

	Resource title		Latest update
PDF	TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2		18 Jan 2021	18 Jan 2021 TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5 of 9)

	Resource title	Latest update
PDF	DT0105 1-point or 3-point tumble sensor calibration 1.1	21 Jan 2021	21 Jan 2021 DT0105 1-point or 3-point tumble sensor calibration 1.1
PDF	DT0076 Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation 1.0	28 Feb 2020	28 Feb 2020 DT0076 Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation 1.0
PDF	DT0103 Compensating for magnetometer installation error and hard-iron effects using accelerometer-assisted 2D calibration 1.0	30 Aug 2018	30 Aug 2018 DT0103 Compensating for magnetometer installation error and hard-iron effects using accelerometer-assisted 2D calibration 1.0
PDF	DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0	08 Jan 2021	08 Jan 2021 DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
PDF	DT0131 Digital magnetometer and e-Compass: efficient design tips 1.0	12 Dec 2018	12 Dec 2018 DT0131 Digital magnetometer and e-Compass: efficient design tips 1.0
PDF	DT0059 Ellipsoid or sphere fitting for sensor calibration 3.0	28 Feb 2020	28 Feb 2020 DT0059 Ellipsoid or sphere fitting for sensor calibration 3.0
PDF	DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0	11 Jan 2021	11 Jan 2021 DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
PDF	DT0104 Exploiting the magnetometer as a virtual gyroscope at low and ultra-high spin rates 1.0	30 Aug 2018	30 Aug 2018 DT0104 Exploiting the magnetometer as a virtual gyroscope at low and ultra-high spin rates 1.0
PDF	DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1	21 Jan 2021	21 Jan 2021 DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1

ツール&ソフトウェア用アプリケーション・ノート (1)

	Resource title		Latest update
PDF	AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 2.0		24 Mar 2021	24 Mar 2021 AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 2.0

パンフレット (3)

	Resource title	Latest update
PDF	MEMS and Sensors Quick Reference Guide 1.1	07 Apr 2021	07 Apr 2021 MEMS and Sensors Quick Reference Guide 1.1
PDF	MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.1	06 Aug 2020	06 Aug 2020 MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.1
PDF	Sensor libraries software pack for STM32Cube 2.0	25 Feb 2021	25 Feb 2021 Sensor libraries software pack for STM32Cube 2.0

EDA Symbols, Footprints and 3D Models

品質 & 信頼性

製品型番	Marketing Status	パッケージ	RoHSコンプライアンスグレード	材料宣誓書**
LSM303AGR	評価中	LGA 2X2X1 12LD PITCH 0.5MM	Ecopack2	PDF XML
LSM303AGRTR	量産中	LGA 2X2X1 12LD PITCH 0.5MM	Ecopack2	PDF XML

LSM303AGR

Package:

LGA 2X2X1 12LD PITCH 0.5MM

Material Declaration**:

PDF XML

More Info

LSM303AGRTR

Package:

LGA 2X2X1 12LD PITCH 0.5MM

Material Declaration**:

PDF XML

More Info

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番	販売代理店から購入	STから購入	製品ステータス	ECCN (US)	ECCN (EU)	梱包タイプ	パッケージ	温度（℃）		Country of Origin	Budgetary Price (US$)*/Qty
製品型番	販売代理店から購入	STから購入	製品ステータス	ECCN (US)	ECCN (EU)	梱包タイプ	パッケージ	最小	最大	Country of Origin	Budgetary Price (US$)*/Qty
LSM303AGRTR	販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください		量産中	EAR99	NEC	Tape And Reel	LGA 2X2X1 12LD PITCH 0.5MM	-40	85	MALTA	1.485 / 1k
LSM303AGR	販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください		評価中	EAR99	NEC	Tray	LGA 2X2X1 12LD PITCH 0.5MM	-40	85	MALTA

LSM303AGRTR

製品ステータス

量産中

ECCN (US)

EAR99

詳細情報

Budgetary Price (US$)*/Qty

1.485 / 1k

LSM303AGR

製品ステータス

評価中

ECCN (US)

EAR99

詳細情報

Budgetary Price (US$)*/Qty

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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製品スペック (1)

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技術ノート & 解説 (1)

Design Notes & Tips (5 of 9)

ツール&ソフトウェア用アプリケーション・ノート (1)

パンフレット (3)

EDA Symbols, Footprints and 3D Models

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