ST33TPHF2ESPI

量産中

Trusted Platform Module 1.2 & 2.0 with TCG SPI interface

データブリーフのダウンロード
概要
Online design
サンプル & 購入
ソリューション
ドキュメント
CADリソース
ツール & ソフトウェア
品質 & 信頼性
Partner products
Sales Briefcase

製品概要

概要

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark. It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
The ST33TPHF2ESPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
The ST33TPHF2ESPI supports two exclusive modes that support either TPM 1.2 or TPM 2.0 commands. The product can be locked irreversibly in TPM 1.2 or TPM 2.0 mode during provisioning, or only after provisioning to provide a smooth migration between TPM 1.2 and TPM 2.0.
The ST33TPHF2ESPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.
  • 特徴

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set
      • Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly
      • For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3
      • For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence for TPM 1.2 and TPM 2.0
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • HMAC SHA-1 & SHA-256
        • AES-128-192-256
        • ECC 224 & 256 bits
    • Product compliance
      • TPM 1.2 compliant with Microsoft® Windows® 7, 8.1 and 10
      • TPM 2.0 compliant with Microsoft Windows 10
      • Compliant with Intel® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode
      • TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites

おすすめ製品

推奨コンテンツ

All tools & software

    • 製品型番
      ステータス
      概要
      タイプ
      サプライヤ

      STPM4RasPI

      量産中

      TPM development kit

      Secure MCU Eval Boards --
      STPM4RasPI

      概要:

      TPM development kit

EDAシンボル / フットプリント / 3Dモデル

STMicroelectronics - ST33TPHF2ESPI

アプリケーションに適したEDAシンボル、フットプリント、および3Dモデルをダウンロードしてご利用頂けます。また、ご使用の設計ツールチェーンに対応したさまざまなCADフォーマットもご利用頂けます。

Symbols

EDAシンボル

Footprints

フットプリント

3D model

3Dモデル

品質 & 信頼性

製品型番 マーケティング・ステータス パッケージ RoHSコンプライアンスグレード 材料宣誓書**
ST33HTPH2E28AHD0
NRND
TSSOP-28 Ecopack2
ST33HTPH2E32AHD0
量産中
VFQFPN 32 5x5x1.0 mm Ecopack2

ST33HTPH2E28AHD0

Package:

TSSOP-28

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

TSSOP-28

RoHS Compliance Grade

Ecopack2

ST33HTPH2E32AHD0

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番
販売代理店から購入
STから購入
製品ステータス
ECCN (US)
ECCN (EU)
梱包タイプ
パッケージ
温度(℃) Country of Origin
Budgetary Price (US$)*/Qty
最小
最大
ST33HTPH2E32AHD0

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
EAR99 NEC Tape And Reel VFQFPN 32 5x5x1.0 mm 0 70 PHILIPPINES
ST33HTPH2E28AHD0

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

NRND
EAR99 NEC Tape And Reel TSSOP-28 0 70 PHILIPPINES

ST33HTPH2E32AHD0

製品ステータス

量産中

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

VFQFPN 32 5x5x1.0 mm

Operating Temperature (°C)

(最小)

0

(最大)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST33HTPH2E28AHD0

製品ステータス

NRND

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

TSSOP-28

Operating Temperature (°C)

(最小)

0

(最大)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*)概算用の参考価格(US$)です。現地通貨でのお見積りについては、STのセールス・オフィス または販売代理店 までお問い合わせください。