STA1385

批量生产

Telemaco3P automotive family of telematics and connectivity microprocessor

下载数据摘要
概述
Online design
样片和购买
解决方案
Documentation
CAD Resources
工具与软件
质量与可靠性
开始
Partner products
Sales Briefcase

Product overview

描述

STA1385 is a fully automotive, power efficient System-On-Chip, targeting cost effective processing solutions for innovative Telematics and Connectivity applications including Cyber-security protection. It features a powerful Dual ARM Cortex-A7 processor, an embedded and independent Hardware Security Module (HSM), an isolated sub-system based on ARM Cortex-M3 for vehicle CAN interface and a full set of standard connectivity interfaces, including a dual Gbit ETH AVB controller and Flexray.
  • All features

    • AEC-Q100 qualified Grade 2 Core and Infrastructure
    • Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support
    • Memory organization:Embedded Vehicle Interface
      • L1 Cache: 32 KB I, 32 KB D
      • L2 Cache: 256 KB
      • Total embedded SRAM: 768 KB
    • Isolated Cortex-M3 core
      • L1 Cache: 8 KB I
    • 256 KB reserved embedded SRAM (extendible to 768 KB)
    • 1x CAN Standard (C_CAN)
    • 2x CAN FD (M_CAN)
    • 1x Flexray
    • 1x SD/MMC/SDIO SDR50 (SD/MMC0)
    • 1x SD/MMC/SDIO SDR25 (SD/MMC1)
    • 1x USB 2.0 DR with HS PHY and HSIC
    • 1x USB 2.0 DR with HS PHY
    • 2x ETH AVB MAC with RMII/RGMII
    • HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)
    • Cryptographic Functions Accelerators
      • Symmetric keys: MP AES
      • Public keys: RSA, ECC
      • Hash: MD5, SHA1, SHA2
    • True Random Number Generator
    • User pogrammable OTP memory (eHSM OTP)
    • 16-bit DDR3L-1066 (533 MHz)
    • 16-bit LPDDR2-800 (400 MHz)
    • SQI Interface
    • 8-bit Parallel NAND (1 chip select)
    • 1x 6-channel 10-bits ADC
    • 3x I2C multi-master/slave interfaces
    • 6x UART controller
    • 3xI2S audio interfaces
    • 3x Synchronous Serial Port (SSP/SPI)
    • 5x 32-bit GPIO ports
    • JTAG based in-circuit emulator (ICE) with Embedded Trace Module
    • VDD, VDD_ARM: 1.14 V-1.21 V
    • VDD_IO_3V3: 3.3 V ±10%
    • VDD_IO_SDMMC0: 1.8 V-3.3 V ±10%
    • VDD_IO_BOOT: 1.8 V/3.3 V ±10%
    • VDD_IO_ON: 3.3 V ± 10%
    • VDDQ: 1.35 V ± 5% (DDR3L)
    • Junction temperature range: -40 C/ +150 C

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All tools & software

    • 产品型号
      状态
      描述
      类型
      供应商

      MTP-TC3P-DVK

      批量生产

      Evaluation Kit for Telemaco3P STA1385 Processor in Telematics Platform Application

      SPC5 汽车微控制器评估工具 ST
      MTP-TC3P-DVK

      描述:

      Evaluation Kit for Telemaco3P STA1385 Processor in Telematics Platform Application

      SGP-TC-EVK

      批量生产

      Evaluation Kit for SPC58 Gateway enhanced by Telemaco3P ASIL-B Processor

      SPC5 汽车微控制器评估工具 ST
      SGP-TC-EVK

      描述:

      Evaluation Kit for SPC58 Gateway enhanced by Telemaco3P ASIL-B Processor

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STA1385

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STA1385EOAS2
批量生产
LFBGA 361 16x16x1.7 汽车应用 Ecopack2

STA1385EOAS2

Package:

LFBGA 361 16x16x1.7

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

LFBGA 361 16x16x1.7

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Budgetary Price (US$)*/Qty
最小值
最大值
STA1385EOAS2 无法联系到经销商,请联系我们的销售办事处
批量生产
5A992C 5A002A4 Tray LFBGA 361 16x16x1.7 -40 105

STA1385EOAS2

供货状态

批量生产

ECCN (US)

5A992C

ECCN (EU)

5A002A4

包装类型

Tray

封装

LFBGA 361 16x16x1.7

Operating Temperature (°C)

(最小值)

-40

(最大值)

105

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商