STiD337

批量生产

卫星收发器基于ARM® Cortex®的SoC,具有集成的DVB-S2/S2X正向链路和用于返回链路的IQ流转化器

下载数据摘要
概述
Online design
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
Partner products
Sales Briefcase

产品概述

描述

The STiD337 is a system-on-chip (SoC) for interactive satellite applications that includes an integrated DVB-S2/S2X demodulator for the satellite forward link with flexible GSE and MPEG-TS PID filtering. The compute platform is based on a dual-core ARM®Cortex®-A9 architecture with Neon™ coprocessors and multiple ST231 DSP offload processors.
The return link implements an IQ streamer which streams a linked list of pre-calculated data to the integrated 10-bit DACs for IQ output to external up-converters.
Accurate Network clock recovery (NCR) with precision real-time control is implemented for the most demanding applications.
Multiple interfaces such as integrated Ethernet physical layer (PHY), USB, PCIe, VCXO, GPIO, SPI, I2C, and I2S are included to provide a complete low-cost satellite modem.
  • 所有功能

    • Integrated DVB-S/S2/S2X demodulator
    • Dual core ARM®Cortex®-A9 application CPU:
      • Up to 1.2 GHz and 6000 DMIPS
      • NEON™ accelerator
      • 512-Kbyte L2 cache
    • DDR3/3L 16-bit interface running at up to 1066 MHz (DDR3-2133)
    • Integrated ARM®Cortex®-M4 standby controller with low-power micro and power islands
    • Quad ST231 offload CPUs
    • IQ data pipe and streaming engine to high-speed DACs
    • Sample-rate conversion filter including root-raised-cosine
    • High-speed IQ signal DACs
    • High-precision low-speed DACs
    • Connectivity:
      • 2 x USB 2.0 ports
      • 1 x PCIe port
      • 1 x SD card
      • 1 x eMMC
      • 1 x RGMII muxed with internal Ethernet PHY
      • 4 x input transport streams
      • 6 x UART
      • 9 x I2C
    • Package: FCBGA 16 mm x 16 mm, 0.65 mm pitch, 552 balls

特别推荐

EDA符号、封装和3D模型

STMicroelectronics - STiD337

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STID337-DCB
批量生产
FCBGA16X16 工业 Ecopack2
STID337ZCB
批量生产
FCBGA16X16 工业 Ecopack2
STiD337
建议
- 工业 -

STID337-DCB

Package:

FCBGA16X16

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

FCBGA16X16

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STID337ZCB

Package:

FCBGA16X16

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

FCBGA16X16

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STiD337

Package:

-

Material Declaration**:

Marketing Status

建议

Package

-

Grade

Industrial

RoHS Compliance Grade

-

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
STiD337 无法联系到经销商,请联系我们的销售办事处
建议
- - - - - - -
STID337-DCB 无法联系到经销商,请联系我们的销售办事处
批量生产
3A991A2 NEC Tray FCBGA16X16 - - -
STID337ZCB 无法联系到经销商,请联系我们的销售办事处
批量生产
3A991A2 NEC Tray FCBGA16X16 - - FRANCE

STiD337

供货状态

建议

ECCN (US)

-

Budgetary Price (US$)*/Qty

ECCN (EU)

-

包装类型

-

封装

-

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Budgetary Price (US$)* / Qty

Country of Origin

-

STID337-DCB

供货状态

批量生产

ECCN (US)

3A991A2

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tray

封装

FCBGA16X16

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Budgetary Price (US$)* / Qty

Country of Origin

-

STID337ZCB

供货状态

批量生产

ECCN (US)

3A991A2

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tray

封装

FCBGA16X16

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商