LSM6DSO32X

批量生产

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

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产品概述

描述

The LSM6DSO32X is a system-in-package featuring a 3D digital accelerometer at 32 g and a 3D digital gyroscope, boosting power performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience in wearable, hard-fall detection, navigation and asset tracking applications. The LSM6DSO32X supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO32X embeds a dedicated core for Machine Learning processing (MLC) and a Finite State Machine (FSM) that provides system flexibility, allowing some algorithms run in the application processor to be moved to the MEMS sensor with the advantage of consistent reduction in power consumption.
The LSM6DSO32X has a full-scale acceleration range of ±4/±8/±16/±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32X the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32X is available in a plastic land grid array (LGA) package.
  • 所有功能

    • Power consumption: 0.55 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 9 kbytes
    • Android compliant
    • ±4/±8/±16/±32 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (1.62 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
    • Advanced pedometer, step detector and step counter
    • Significant Motion Detection, tilt detection
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Programmable Finite State Machine: accelerometer, gyroscope and external sensors
    • Machine Learning Core
    • Embedded temperature sensor
    • ECOPACK, RoHS and “Green” compliant

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EDA符号、封装和3D模型

STMicroelectronics - LSM6DSO32X

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

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质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
LSM6DSO32XTR
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSO32XTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
LSM6DSO32XTR 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES 3.24

LSM6DSO32XTR

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

3.24

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(最小值)

-40

(最大值)

85

Budgetary Price (US$)* / Qty

3.24

Country of Origin

PHILIPPINES

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商