产品概述
描述
This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.-
所有功能
- ACEPACK™ 1 power module
- DBC Cu Al2O3 Cu
- Sixpack topology
- 1200 V, 35 A IGBTs and diodes
- Soft and fast recovery diode
- Integrated NTC
- ACEPACK™ 1 power module
All tools & software
All resources
| Resource title | Latest update |
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产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 16 Nov 2018 | 16 Nov 2018 |
技术文档 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 | 13 Sep 2018 |
简报 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 15 Jun 2018 | 15 Jun 2018 | |||
| 07 Apr 2021 | 07 Apr 2021 | |||
| 20 Mar 2021 | 20 Mar 2021 |
宣传册 (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 04 May 2020 | 04 May 2020 | |||
| 04 May 2020 | 04 May 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - A1P35S12M3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| A1P35S12M3 | 2 distributors | Buy Direct | 批量生产 | EAR99 | NEC | Tray | ACEPACK 1 | - | - | PHILIPPINES | 26.4 / 100 | |
