产品概述
描述
This second series of SLLIMM (small low-loss intelligent molded module) nano provides a compact, high-performance AC motor drive in a simple, rugged design. It is composed of six improved short-circuit rugged trench gate fieldstop IGBTs with freewheeling diodes and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is designed to allow a better and more easily screwed-on heat sink, and is optimized for thermal performance and compactness in built-in motor applications or other low power applications where assembly space is limited. This IPM includes a completely uncommitted operational amplifier and a comparator that can be used to design a fast and efficient protection circuit. SLLIMM is a trademark of STMicroelectronics.-
所有功能
- IPM 6 A, 600 V, 3-phase IGBT inverter bridge including 3 control ICs for gate driving and freewheeling diodes
- 3.3 V, 5 V, 15 V TTL/CMOS input comparators with hysteresis and pull-down/pull-up resistors
- Internal bootstrap diode
- Optimized for low electromagnetic interference
- Undervoltage lockout
- Short-circuit rugged TFS IGBT
- Shutdown function
- Interlocking function
- Op-amp for advanced current sensing
- Comparator for fault protection against overcurrent
- Isolation ratings of 1600 Vrms/min.
- NTC (UL 1434 CA 2 and 4)
- Up to ±2 kV ESD protection (HBM C = 100 pF, R = 1.5 kΩ)
- UL recognition: UL 1557, file E81734
All tools & software
All resources
| Resource title | Latest update |
|---|
产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 26 Jan 2021 | 26 Jan 2021 |
应用手册 (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 22 Nov 2018 | 22 Nov 2018 | |||
| 19 Mar 2021 | 19 Mar 2021 |
技术文档 (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 |
用户手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 |
简报 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Jul 2018 | 13 Jul 2018 | |||
| 07 Apr 2021 | 07 Apr 2021 | |||
| 20 Mar 2021 | 20 Mar 2021 |
宣传册 (5 of 6)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 23 Feb 2021 | 23 Feb 2021 | |||
| 06 May 2020 | 06 May 2020 | |||
| 04 May 2020 | 04 May 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 04 May 2020 | 04 May 2020 | |||
| 14 Oct 2020 | 14 Oct 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STGIPQ4C60T-HL
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STGIPQ4C60T-HL | 批量生产 | N2DIP-26L | 工业 | Ecopack2 | |
STGIPQ4C60T-HL
Package:
N2DIP-26LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| STGIPQ4C60T-HL | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tube | N2DIP-26L | - | - | CHINA | 4.55 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
4.55 / 1k