产品概述
描述
The HSP031-1BM6 is a single channel ESD array with a rail to rail architecture designed to protect 2 differential lines from over voltages event caused by ESD, surge (8/20 µs). Packaged in a QFN-6L, the device is designed specifically for the protection of high-speed differential lines such as Ethernet 10 Gbps.-
所有功能
- High ESD protection level exceeding IEC 61000-4-2 level 4:
- ±30kV (contact discharge)
- ±30kV (air discharge)
- High IEC 61000-4-5 surge capability: 10 A
- Very low dynamic resistance: 0.25 Ohm
- Low capacitance: 0.7 pF
- High ESD protection level exceeding IEC 61000-4-2 level 4:
精选 视频
During this one-hour webinar, you will learn how to make your electronic system more robust against destructive Electrostatic Discharges (ESD) by using ST ESD Protection components. During this webinar you will learn about: - ESD major root causes and EMC standards - ST ESD Protections, which can help to protect your application againts ESD - Many real application examples demonstrating where protections play an important role - How to select the best protection for your usecases
ESDCAN01-2BLY with up to 30 kV ESD and overvoltage protection, with high surge capability at high temperature
PEP01-5841, for Power over Ethernet supply lines
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 03 Jun 2020 | 03 Jun 2020 |
应用手册 (5)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 06 Aug 2019 | 06 Aug 2019 | ||
| 1.2 | 06 Aug 2019 | 06 Aug 2019 | ||
| 1.0 | 14 Dec 2015 | 14 Dec 2015 | ||
| 5.0 | 13 Sep 2018 | 13 Sep 2018 | ||
| 1.0 | 06 Jul 2021 | 06 Jul 2021 |
技术文档 (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 09 Dec 2020 | 09 Dec 2020 | ||
| 9.0 | 24 May 2021 | 24 May 2021 |
简报 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 18 Nov 2019 | 18 Nov 2019 | ||
| 1.0 | 14 Apr 2021 | 14 Apr 2021 | ||
| 2.0 | 18 Dec 2015 | 18 Dec 2015 | ||
| 1.0 | 18 May 2015 | 18 May 2015 |
宣传册 (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 09 Apr 2021 | 09 Apr 2021 | ||
| 1.0 | 09 Apr 2021 | 09 Apr 2021 |
手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 14 Apr 2021 | 14 Apr 2021 |
EDA符号、封装和3D模型
STMicroelectronics - HSP031-1BM6
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 18 Jun 2021 | 18 Jun 2021 | |
| ZIP | 1.0 | 06 Jan 2021 | 06 Jan 2021 |
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Breakdown Voltage (V) (min) | Directionality | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| HSP031-1BM6 | 2 distributors | Free Sample Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | QFN-6L | - | - | 9 | Bi-Directional | CHINA | 0.267 / 300 | ||
